Group News and Media Coverage

September 16, 2024

Dr. Yuxuan Cosmi Lin and a team of researchers are studying the advantages of using semi-metals in different applications. 

Link: https://engineering.tamu.edu/news/2024/09/the-future-of-semi-metal-electronics.html

August 1, 2024

Our most review article: "The Rise of Semi-Metal Electronics" has been published on Nature Reviews Electrical Engineering. In this article, we overviewed the emerging electron transport phenomena in different types of semimetals and introduced new microelectronic device concepts enabled by semimetals. It has been a great experience working with our strong team, Prof. Cong Su at Yale University and Prof. Qiming Shao at HKUST, and our amazing students/postdocs, Enzi Zhai, Tianyu Liang, Ruizi Liu, Mingyang Cai, Ran Li. Congratulations to all!

Link to the article: https://www.nature.com/articles/s44287-024-00068-z

Online read-only link of the pdf version: https://rdcu.be/dPFw5 

March 15, 2024

Prof. Cosmi Lin received a research grant from the NASA On-Demand Manufacturing of Electronics (ODME) program. We will be working with NASA closely and develop new device fabrication and characterization technologies for 2D semiconductor field-effect transistors for radiation hardened microelectronics applications.

January 15, 2024

Our graduate student, Mr. Farhan Zahin, is awarded the Samsung Austin Semiconductor Fellowship. He will lead a team of four other undergraduate awardee, Mr. Matthew Cupich, Ms. Rachel Lee, Mr. Dhruv Nandwani, and Mr. Christian Schade, and work on a two-semester project about substitutional doping of 2D semiconductors. Congratuations!

Making low-resistance metal contacts to 2D materials is a bottleneck to their practical use in CMOS transistors. Progress has been made with n-type contacts for use with nFETs, but low-resistance p-type contacts for use with pFETs are more challenging because of the electro-thermodynamic conditions that arise between p-type metals and 2D materials. These conditions create an energy mismatch called the Schottky barrier: the greater the Schottky barrier height, the greater the resistance to current flow. In the paper #28.1, a TSMC-led team conducted computational modeling and simulation studies to investigate various materials for use as p-type contacts to the 2D material WSe2. As a result of these studies, they identified two new strategies as realistic pathways to achieving Schottky barrier-free (i.e., ohmic) low-resistance p-type contacts: van der Waals metallic contacts using a material like 1T-TiS2, and bulk semi metallic contacts using various materials, of which Co3Sn2S2 was identified as exceptionally good, with a theoretical contact resistance as low as 20 Ω·μm. Physical experiments were performed to further evaluate it.

Link: https://www.ieee.org/ns/periodicals/EDS/EDS-JANUARY-2023-HTML/index.html

Researchers at leading foundry TSMC are developing transistors with feature sizes below 1nm to scale chip designs even further and have shown the first nanosheet transistor with a gate all around (GAA) topology.

A TSMC-led team conducted computational computer modeling and simulation studies to investigate various materials for use as p-type contacts to the 2D material WSe2.

Link: https://www.eenewseurope.com/en/tsmc-heads-below-1nm-with-2d-transistors-at-iedm/

A paper co-authored by Berkeley EECS Prof. Jeffrey Bokor, his postdoc Yuxuan Lin, Berkeley Physics Prof. Alex Zettl, his postdoc Cong Su, and researchers at MIT, among others, describes a more efficient method of connecting atomically thin 2-D materials to other chip elements, making them a more promising alternative to 3-D silicon-based transistors.  

Link: https://eecs.berkeley.edu/news/2021/05/2-d-semiconductor-contact-resistances-approach-quantum-limit

Atomically thin materials are a promising alternative to silicon-based transistors; now researchers can connect them more efficiently to other chip elements.

Link: https://news.mit.edu/2021/2d-transistors-microchip-0513

Researchers at MIT reported a method of depositing different materials within a single chip layer, which could lead to more efficient computers. 

Link: http://news.mit.edu/2016/new-chip-fabrication-approach-0127